Format: 2 - Layer - Plated through<br><br>Size: 107,00mm x 87,00mm = 0,93dm²<br><br>Material: Rogers 4350B 1.55mm 70µm Cu<br><br>Surface: chemical gold 2U<br><br>Min Track / Space: 200µm<br><br>Min. Drill Dia.: 0.3mm<br><br>Solderstop: without<br><br>Marking Print: without<br><br>E-Test: Yes

Panel: 8019.01_0394271-01<br><br>Type: 15-Pieces-Simple Panel<br><br>Format: 8 - Layer - Multilayer<br><br>Surface:Chemical gold 2U<br><br>Mech. treatment:Milled with perf.bridges<br><br>Panel-Size: 172,80mm x 99,50mm = 1,72dm²<br><br>Material: FR4 Tg 150 S1000H 1.0mm OL:35µm / IL:35µm Cu<br><br>Min Track / Space:100µm<br><br>Min. Drill Dia:0.1mm<br><br>Soldermask: Top + Bottom, green<br><br>Marking Print: without<br><br>E-Test: Yes<br><br>Sideplating: Yes<br><br>Burried Vias: Yes<br><br>Blind Vias: Yes

Format: 8 - Layer - Multilayer<br><br>Size: 306,00mm x 313,00mm = 9,58dm2<br><br>Material: FR4 Tg 150 1.55mm OL:70μm / IL:70μm Cu<br><br>Surface: galv. hard gold 30U<br><br>Min Track / Space: 150μm<br><br>Min. Drill Dia.: 0.2mm<br><br>Solderstop: without<br><br>Marking Print: without<br><br>E-Test: Yes<br><br>Blind Vias: Yes<br><br>Filled & Capped Via: IPC 4761 Type VII<br><br>IPC class 3: Yes

Type: 1-Pieces-Simple Panel <br>Mech. treatment: Milled<br>Format: 4 - Layer - Multilayer <br>Material: Rigid-Flex 1.0 OL:35µm / IL:35µm Cu <br>Surface: chemical gold 2U<br>Min Track / Space: 150µm <br>Min. Drill Dia.: 0.2mm <br>Soldermask: Top + Bottom, green <br>Marking Print: None<br>E-Test: Yes